Title:
RESIN COMPOSITION, CURED PRODUCT, AND ORGANIC EL DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/070802
Kind Code:
A1
Abstract:
A resin composition containing (a) at least one resin selected from the group consisting of polyimides, polyimide precursors, polybenzoxazoles, any precursors thereof, and copolymers of these and (b) a photoacid generator, wherein the component (a) contains at least a diamine residue of formula (1) and a diamine residue of formula (2) and contains a tetracarboxylic acid residue of formula (3) and/or a dicarboxylic acid residue of formula (4), has 15-80 mol% of the diamine residue of formula (1) and 20-85 mol% of the diamine residue of formula (2) per 100 mol% total diamine residues in the component (a), and the total of the diamine residue of formula (1) and the diamine residue of formula (2) is 50-100 mol% per 100 mol% total diamine residues in the component (a). (In formula (1), a and b each independently represent an integer of 1 or 2. * represents a bonding part.) (In formula (2), X represents -C(CH3)2-, -C(CF3)2-, -O-, -S-, -SO2-, or a single bond. * represents a bonding part.) (In formula (3), Y1 represents -C(CH3)2-, -C(CF3)2-, -O-, -S-, -SO2-, or a single bond. * represents a bonding part.) (In formula (4), Y2 represents a group selected from -C(CH3)2-, -C(CF3)2-, -O-, -S-, and -SO2-, or a single bond. * represents a bonding part.) Provided is a resin composition that has excellent pattern processability, that can obtain a low-water-absorption cured product, and that can be used suitably in a planarization layer and/or bank layer of an organic EL display device.
Inventors:
BABA OSAMU (JP)
MIYOSHI KAZUTO (JP)
MIYOSHI KAZUTO (JP)
Application Number:
PCT/JP2023/033868
Publication Date:
April 04, 2024
Filing Date:
September 19, 2023
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L79/08; C08G73/10; C08G73/22; C08K5/23; H05B33/12; H05B33/22; H10K50/10; H10K59/00
Domestic Patent References:
| WO2022045737A1 | 2022-03-03 | |||
| WO2008059724A1 | 2008-05-22 |
Foreign References:
| JP2011202059A | 2011-10-13 | |||
| KR20160004468A | 2016-01-13 | |||
| JP2011042701A | 2011-03-03 | |||
| CN106515130A | 2017-03-22 | |||
| CN112940316A | 2021-06-11 | |||
| JP2009506349A | 2009-02-12 |
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