Title:
RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR ELEMENT, AND DRY FILM RESIST
Document Type and Number:
WIPO Patent Application WO/2024/079923
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that can be patterned with light, has a glass transition temperature of 200°C or higher, and has a low dielectric dissipation factor. This resin composition comprises: (A) a bismaleimide compound that is obtained by reacting an aromatic diamine (a-1) represented by formula (1), a tetrabasic acid dianhydride (a-3), and maleic anhydride and that has a cyclic imide linkage; and (B) a maleimide compound other than the bismaleimide compound (A).
Inventors:
TSUBAMOTO MAI (JP)
TAKEDA MAO (JP)
YAMAMOTO KAZUYOSHI (JP)
IIZUKA MASAYUKI (JP)
TAKEDA MAO (JP)
YAMAMOTO KAZUYOSHI (JP)
IIZUKA MASAYUKI (JP)
Application Number:
PCT/JP2023/013226
Publication Date:
April 18, 2024
Filing Date:
March 30, 2023
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08F299/02; C08F222/40; G03F7/004; G03F7/027; G03F7/037; H01L23/29; H01L23/31; H05K1/03; H05K3/28
Attorney, Agent or Firm:
KIUCHI Mitsuharu et al. (JP)
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