Title:
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/079924
Kind Code:
A1
Abstract:
Provided are a resin composition that does not inhibit a photocuring reaction in an exposure step and that can provide excellent alkali developability in a development step, and a resin sheet, a multilayer printed wiring board, and a semiconductor device using the same. A resin composition comprising a bismaleimide compound (A) represented by general formula (1), a compound (B) containing one or more carboxy groups, and a photocuring initiator (C). (In formula (1), R3 independently represent a tetravalent organic group containing a cyclic structure. R2 independently are a C6-200 divalent hydrocarbon group. R1 independently are represented by formula (2) (R5 each independently represent a hydrogen atom, a C1-6 linear or branched alkyl group, a halogen atom, a hydroxy group, or a C1-6 linear or branched alkoxy group. I each independently represent an integer of 1-4.). R4 is R1 or R2. m is 1-100 and n is 0-100. Also, the order of each repeating unit bracketed by m and n is not limited, and the bonding pattern may be alternate, block, or random.)
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Inventors:
TSUBAMOTO MAI (JP)
TAKEDA MAO (JP)
YAMAMOTO KAZUYOSHI (JP)
IIZUKA MASAYUKI (JP)
TAKEDA MAO (JP)
YAMAMOTO KAZUYOSHI (JP)
IIZUKA MASAYUKI (JP)
Application Number:
PCT/JP2023/013228
Publication Date:
April 18, 2024
Filing Date:
March 30, 2023
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08F290/06; B32B27/32; C08F2/44; C08F299/02; H05K1/03
Attorney, Agent or Firm:
KIUCHI Mitsuharu et al. (JP)
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