Title:
RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR ELEMENT, AND DRY FILM RESIST
Document Type and Number:
WIPO Patent Application WO/2024/079926
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that has excellent compatibility, that can be cured by means of light, and that requires less heating time and an additional heating temperature that is lower than 100°C. This resin composition contains: a bismaleimide compound (A) that is obtained by reacting an aromatic diamine (a-1) represented by formula (1), a tetrabasic acid dianhydride (a-3), and maleic acid anhydride, and that has a cyclic imide bond; a resin or compound (B) having an ethylenically unsaturated group; and a photocuring initiator (C). (Each R1 independently represents a hydrogen atom, a linear or branched alkyl group having 1-6 carbon atoms, a halogen atom, a hydroxy group, or a linear or branched alkoxy group having 1-6 carbon atoms. Each l independently represents an integer of 1-4.)
Inventors:
TAKEDA MAO (JP)
TSUBAMOTO MAI (JP)
YAMAMOTO KAZUYOSHI (JP)
IIZUKA MASAYUKI (JP)
TSUBAMOTO MAI (JP)
YAMAMOTO KAZUYOSHI (JP)
IIZUKA MASAYUKI (JP)
Application Number:
PCT/JP2023/013231
Publication Date:
April 18, 2024
Filing Date:
March 30, 2023
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08F299/02; C08F222/40; C08F290/06; G03F7/004; G03F7/027; H01L23/12; H05K1/03
Attorney, Agent or Firm:
KIUCHI Mitsuharu et al. (JP)
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