Title:
RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR ELEMENT, AND DRY FILM RESIST
Document Type and Number:
WIPO Patent Application WO/2024/079925
Kind Code:
A1
Abstract:
The present invention relates to a resin composition comprising a maleimide resin that is compatible even when main skeletons are different from each other. The objective of the present invention is to provide: a curable resin composition exhibiting excellent photocurability and heat resistance; and a cured product thereof. It was found that a curable resin composition having excellent compatibility, photocurability, and heat resistance is obtained by forming a resin composition including: a bismaleimide compound (A) having a cyclic imide bond obtained by reacting a specific aromatic diamine (a-1), a tetrabasic acid dianhydride (a-3), and a maleic anhydride; and a maleimide compound (B) including a structure derived from dimer diamine.
Inventors:
TAKEDA MAO (JP)
TSUBAMOTO MAI (JP)
YAMAMOTO KAZUYOSHI (JP)
IIZUKA MASAYUKI (JP)
TSUBAMOTO MAI (JP)
YAMAMOTO KAZUYOSHI (JP)
IIZUKA MASAYUKI (JP)
Application Number:
PCT/JP2023/013230
Publication Date:
April 18, 2024
Filing Date:
March 30, 2023
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08F299/02; C08F222/40; G03F7/027; H01L23/29; H01L23/31; H05K1/03
Attorney, Agent or Firm:
KIUCHI Mitsuharu et al. (JP)
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