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Title:
RESIN COMPOSITION, ELECTROCONDUCTIVE RESIN COMPOSITION, ADHESIVE, ELECTROCONDUCTIVE ADHESIVE, PASTE FOR FORMING ELECTRODES, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/158829
Kind Code:
A1
Abstract:
Provided is a resin composition having long-term heat resistance, with which the rate of change in adhesive strength is low. The resin composition includes: (A) a compound having an OH group and any of a primary to tertiary amine in the molecule; (B) dicyandiamide; and (C) a bismaleimide.

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Inventors:
YAMAGUCHI TAKASHI (JP)
ABE SHINICHI (JP)
Application Number:
PCT/JP2016/059843
Publication Date:
October 06, 2016
Filing Date:
March 28, 2016
Export Citation:
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Assignee:
NAMICS CORP (JP)
International Classes:
C08L61/34; C08G14/073; C08G59/56; C08G73/00; C08G73/12; C08L63/00; C09J9/02; C09J11/00; C09J161/34; C09J179/04; H01L21/288
Domestic Patent References:
WO2004037878A22004-05-06
Foreign References:
JP2010260971A2010-11-18
US20140323624A12014-10-30
JP2014141603A2014-08-07
JP2013001853A2013-01-07
CN102208538A2011-10-05
JP2010150463A2010-07-08
JPS5224289A1977-02-23
Other References:
See also references of EP 3279262A4
Attorney, Agent or Firm:
ISSHIKI & CO. (JP)
All international patent business corporation (JP)
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