Title:
RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/120740
Kind Code:
A1
Abstract:
A resin composition containing an epoxy resin, a curing agent, and a curing promoter, the glass transition temperature of a cured product being 150°C or higher, the curing promoter containing no functional group reacting with epoxy groups.
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Inventors:
UCHIYAMA CHIKA (JP)
FUSUMADA MITSUAKI (JP)
KOIKE DAIKI (JP)
SHIRAGAMI MASASHI (JP)
SAITO TAKAHIRO (JP)
NEGOR SHUHEI (JP)
KAMIMURA KAZUYA (JP)
SAITO TAKESHI (JP)
FUSUMADA MITSUAKI (JP)
KOIKE DAIKI (JP)
SHIRAGAMI MASASHI (JP)
SAITO TAKAHIRO (JP)
NEGOR SHUHEI (JP)
KAMIMURA KAZUYA (JP)
SAITO TAKESHI (JP)
Application Number:
PCT/JP2022/048407
Publication Date:
June 29, 2023
Filing Date:
December 27, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08G59/40
Foreign References:
| JP2009019115A | 2009-01-29 | |||
| JPH08104796A | 1996-04-23 | |||
| JP2019044081A | 2019-03-22 | |||
| JP2003292580A | 2003-10-15 | |||
| JP2014005383A | 2014-01-16 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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