Title:
EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/120739
Kind Code:
A1
Abstract:
An epoxy resin composition according to the present invention contains an epoxy resin, a curing agent, an inorganic filler and a silicone compound; and the silicone compound is configured so as to satisfy the relational expression (viscosity A) < (viscosity B), where (viscosity A) is the viscosity at 175°C of the epoxy resin composition in which 0.0015% by mass or more of the silicone compound is added relative to the total solid content of the epoxy resin composition, and (viscosity B) is the viscosity at 175°C of a composition which is obtained by removing the silicone compound from the epoxy resin composition.
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Inventors:
KANG DONGCHUL (JP)
IKEDA TOMOHIRO (JP)
SHIRAGAMI MASASHI (JP)
UCHIYAMA CHIKA (JP)
IKEDA TOMOHIRO (JP)
SHIRAGAMI MASASHI (JP)
UCHIYAMA CHIKA (JP)
Application Number:
PCT/JP2022/048051
Publication Date:
June 29, 2023
Filing Date:
December 26, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08L63/00; C08G59/18
Domestic Patent References:
| WO2018135558A1 | 2018-07-26 |
Foreign References:
| JP2000327883A | 2000-11-28 | |||
| JPH10158361A | 1998-06-16 | |||
| JPH10231355A | 1998-09-02 | |||
| JP2000007900A | 2000-01-11 | |||
| JP2021123647A | 2021-08-30 | |||
| JPH08176269A | 1996-07-09 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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