Title:
RESIN COMPOSITION, FILM, MULTILAYER BODY, BONDED STRUCTURE, METHOD FOR PRODUCING MULTILAYER BODY, AND METHOD FOR PRODUCING BONDED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/066974
Kind Code:
A1
Abstract:
A resin composition which contains a resin and capsules that internally contain a core material, and which is configured such that: the capsules have an arithmetic average of maximum diameters of 3 μm or less; and the core material internally contained in the capsules contains at least one substance that is selected from among plasticizers and compounds that decompose the resin. A film, a multilayer body, a bonded structure, a method for producing a multilayer body, and a method for producing a bonded structure, each of which uses this resin composition.
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Inventors:
HOTTA YOSHINORI (JP)
Application Number:
PCT/JP2019/037186
Publication Date:
April 02, 2020
Filing Date:
September 24, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B3/30; C08L101/00; B32B27/22; C08K9/10; C08L63/00; H01R11/01; H05K3/32
Foreign References:
| JP2002356623A | 2002-12-13 | |||
| JP2002163939A | 2002-06-07 | |||
| JPS59204591A | 1984-11-19 | |||
| JP2009288577A | 2009-12-10 | |||
| JP2017113911A | 2017-06-29 | |||
| JP2004227730A | 2004-08-12 | |||
| JP2000294889A | 2000-10-20 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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