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Title:
RESIN COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR FORMING RESIST UNDERLAYER FILM, PATTERN FORMING METHOD, CROSSLINKING AGENT AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2014/014034
Kind Code:
A1
Abstract:
The present invention is a resin composition for forming a resist underlayer film, which contains a resin that contains an aromatic ring and a crosslinking agent that has a partial structure represented by formula (i). In formula (i), X represents a carbonyl group or a sulfonyl group; Q represents a monovalent heteroaromatic group or -OR1; R1 represents a monovalent organic group having 1-30 carbon atoms; Ar represents an aromatic hydrocarbon group or a heteroaromatic group; n represents an integer of 1-8; and in cases where n is 2 or more, the plurality of X moieties may be the same as or different from each other and the plurality of Q moieties may be the same as or different from each other.

Inventors:
MOTONARI MASAYUKI (JP)
TAKIMOTO YOSHIO (JP)
MIZOGUCHI KATSUHISA (JP)
MATSUMURA YUUSHI (JP)
NAKAFUJI SHIN-YA (JP)
KOUMURA KAZUHIKO (JP)
MURAKAMI SATORU (JP)
Application Number:
PCT/JP2013/069442
Publication Date:
January 23, 2014
Filing Date:
July 17, 2013
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
G03F7/11; C07C69/76; C07C251/68; H01L21/027
Domestic Patent References:
WO2009038126A12009-03-26
Foreign References:
JP2010520516A2010-06-10
JP2011170059A2011-09-01
JP2002167435A2002-06-11
Attorney, Agent or Firm:
AMANO KAZUNORI (JP)
Kazuki Amano (JP)
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