Title:
RESIN COMPOSITION FOR FORMING TEMPORARY FIXATIVE, TEMPORARY FIXATIVE, SUPPORT TAPE FOR SUBSTRATE CONVEYANCE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/132158
Kind Code:
A1
Abstract:
This resin composition for forming a temporary fixative contains an acrylic rubber having an epoxy group and a silicone compound having an amine group. When a film is formed by heating this composition for 5 minutes at 90°C and for 5 minutes at 140°C, the modulus of this film is 2 MPa or greater at 100°C and the modulus of this film after heating for 2 hours at 170°C is 500 MPa or greater at 25°C.
Inventors:
OGAWA SAEKO (JP)
SOBUE SHOGO (JP)
SOBUE SHOGO (JP)
Application Number:
PCT/JP2022/043976
Publication Date:
July 13, 2023
Filing Date:
November 29, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08G59/20; H01L21/50; C08G59/50; C08G59/56; H05K3/28; H05K3/34
Foreign References:
| JP2018203973A | 2018-12-27 | |||
| JP2020161823A | 2020-10-01 | |||
| JP2021072375A | 2021-05-06 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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