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Title:
RESIN COMPOSITION FOR GENERATING ALLYL PHENOL-MALEIMIDE COPOLYMER FOR ELECTRONIC COMPONENT PROTECTIVE FILM, AND ELECTRONIC COMPONENT PROTECTIVE FILM COMPRISING THIS COPOLYMER
Document Type and Number:
WIPO Patent Application WO/2020/095882
Kind Code:
A1
Abstract:
A resin composition for generating an allyl phenol-maleimide copolymer for an electronic component protective film, containing (A) an allyl group-containing phenol compound having a rigid structure, (B) an N-aromatic maleimide group-containing compound having a rigid structure, and (C) an N-aliphatic maleimide group-containing compound having a flexible structure.

Inventors:
OHTSUKA KEIKO (JP)
YONEKAWA MORIO (JP)
KIMURA HAJIME (JP)
YOSHIOKA KEN (JP)
KANAMARU NOBUHIRO (JP)
SUWA MASAKI (JP)
MACHIDA KAZUMI (JP)
Application Number:
PCT/JP2019/043221
Publication Date:
May 14, 2020
Filing Date:
November 05, 2019
Export Citation:
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Assignee:
OSAKA RES INST IND SCIENCE & TECH (JP)
KOA CORP (JP)
International Classes:
C08G61/00; C08F222/40; C08K3/22; C08L35/00; H01B3/30; H01C7/00
Domestic Patent References:
WO2016002704A12016-01-07
WO2012014871A12012-02-02
Foreign References:
JPH0264113A1990-03-05
JPH02113006A1990-04-25
JP2014114368A2014-06-26
JP2012201751A2012-10-22
JP2015119125A2015-06-25
JP2016514742A2016-05-23
Attorney, Agent or Firm:
HIRAKI & ASSOCIATES (JP)
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