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Title:
RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/014663
Kind Code:
A1
Abstract:
[Problem] To provide a resin composition having excellent dielectric characteristics and a molded article of the resin composition. [Solution] A resin composition which comprises a wholly aromatic polyester and mica, wherein the wholly aromatic polyester comprises given constituent units (I), (II), (III), and (IV) (in formulae, Ar1 and Ar2 each independently represent an arylene group) as essential constituent components, the content of the constituent unit (I) being 40-75 mol%, the content of the constituent unit (II) being 0.5-7.5 mol%, the content of the constituent unit (III) being 8.5-30 mol%, and the content of the constituent unit (IV) being 8.5-30 mol%, with respect to all the constituent units of the wholly aromatic polyester, the content of the wholly aromatic polyester being 50-95 mass% with respect to the whole resin composition, the content of the mica being 5-50 mass% with respect to the whole resin composition, and the resin composition having a dielectric dissipation factor of 0.002 or less at a measuring frequency of 3 GHz.

Inventors:
MOCHIZUKI MITSUHIRO (JP)
NAGAE AKIHIRO (JP)
SEITOH HIROMITSU (JP)
Application Number:
PCT/JP2021/026568
Publication Date:
January 20, 2022
Filing Date:
July 15, 2021
Export Citation:
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Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08L67/00; C08G63/00; C08K3/34; H01B3/00
Domestic Patent References:
WO2018101214A12018-06-07
WO2020204125A12020-10-08
Foreign References:
JP2019189734A2019-10-31
JP2019189735A2019-10-31
JP2019189736A2019-10-31
JP2018080242A2018-05-24
JP2015183159A2015-10-22
JP2014062182A2014-04-10
JPS63146959A1988-06-18
JP2011021178A2011-02-03
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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