Title:
RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/095683
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition and a molded article with suppressed surface stickiness while having excellent vibration absorbing ability and stress relaxing ability at room temperature. This resin composition (X) contains 10-50 parts by mass of a thermoplastic resin (A) and 50-90 parts by mass of an inorganic substance (B), and exhibits, when the dynamic viscoelasticity thereof is measured at a frequency of 10 rad/s (1.6Hz) in a temperature range of -40°C to 150°C, a tanδ peak temperature of 0-60°C and a tanδ peak value of 0.8-5.0.
Inventors:
UEKUSA TAKAYUKI (JP)
YASUI MOTOYASU (JP)
FUKAGAWA YOSHISADA (JP)
YASUI MOTOYASU (JP)
FUKAGAWA YOSHISADA (JP)
Application Number:
PCT/JP2020/041711
Publication Date:
May 20, 2021
Filing Date:
November 09, 2020
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08F210/14; C08K3/26; C08L23/20
Domestic Patent References:
| WO2016143599A1 | 2016-09-15 | |||
| WO2017209215A1 | 2017-12-07 | |||
| WO2018092494A1 | 2018-05-24 | |||
| WO2001053369A1 | 2001-07-26 | |||
| WO2001027124A1 | 2001-04-19 | |||
| WO2011055803A1 | 2011-05-12 | |||
| WO2014050817A1 | 2014-04-03 |
Foreign References:
| JP2018135415A | 2018-08-30 | |||
| JP2015023099A | 2015-02-02 | |||
| JP2016132692A | 2016-07-25 | |||
| JP2012082388A | 2012-04-26 | |||
| JP2017132920A | 2017-08-03 | |||
| JP2001071378A | 2001-03-21 | |||
| JPH03193796A | 1991-08-23 | |||
| JPH0241303A | 1990-02-09 |
Other References:
See also references of EP 4059969A4
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Download PDF: