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Title:
RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2024/024330
Kind Code:
A1
Abstract:
A resin composition that contains reinforcing fibers in a proportion of 10-300 mass parts per 100 mass parts of a xylylenediamine polyamide resin, in which the xylylenediamine polyamide resin contains diamine units and dicarboxylic acid units, the diamine units contain 70 mol% or more of structural units derived from xylylenediamine, the dicarboxylic acid units contain 70 mol% or more of structural units derived from C11-20 α,ω-straight-chain aliphatic dicarboxylic acids, and the relative viscosity of the xylylenediamine polyamide resin is 1.6 to 2.4.

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Inventors:
ISHIHARA TOMITA ERI (JP)
SHIMADA NAKAMURA JIN (JP)
ODA TAKAFUMI (JP)
Application Number:
PCT/JP2023/022542
Publication Date:
February 01, 2024
Filing Date:
June 19, 2023
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L77/06; C08G69/26; C08J5/04; C08K7/02
Domestic Patent References:
WO2011081099A12011-07-07
WO2012077473A12012-06-14
WO2020137128A12020-07-02
Foreign References:
JP2020536153A2020-12-10
JP2011527369A2011-10-27
JP2011063681A2011-03-31
JP2022054099A2022-04-06
JP2019073736A2019-05-16
JP2015054431A2015-03-23
JP2021028401A2021-02-25
Attorney, Agent or Firm:
SIKS & CO. (JP)
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