Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/024331
Kind Code:
A1
Abstract:
The present invention provides a resin composition which is in a liquid state at 25°C and contains (A) an epoxy resin and (B) methacrylic acid anhydride, wherein the epoxy resin (A) contains (A-1) an epoxy resin that is in a liquid state at 25°C, while containing two or more epoxy groups in each molecule.
Inventors:
OGURA ICHIRO (JP)
OKAZAKI DAICHI (JP)
OKAZAKI DAICHI (JP)
Application Number:
PCT/JP2023/022554
Publication Date:
February 01, 2024
Filing Date:
June 19, 2023
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
C08G59/00; C08F290/06; C08F299/02
Foreign References:
| JPS63145322A | 1988-06-17 | |||
| JP2019112548A | 2019-07-11 | |||
| JPS60255860A | 1985-12-17 | |||
| JP2008150520A | 2008-07-03 | |||
| JP2018189756A | 2018-11-29 | |||
| JP2018172484A | 2018-11-08 | |||
| JP2008038029A | 2008-02-21 | |||
| CN109486264A | 2019-03-19 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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