Title:
RESIN COMPOSITION, MOLDED BODY, ELECTROMAGNETIC WAVE ABSORBER, AND METHOD FOR MANUFACTURING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/181696
Kind Code:
A1
Abstract:
Provided are a resin composition that has a high electromagnetic wave absorption rate, a molded body, an electromagnetic wave absorber, and a method for manufacturing the resin composition. The resin composition contains a thermoplastic resin and carbon nanotubes, and has a dielectric constant of at least 4.50 at a frequency of 76.5 Ghz when molded to a thickness of 2 mm.
Inventors:
ISEKI SHUTA (JP)
SHOJI HIDEKAZU (JP)
SHOJI HIDEKAZU (JP)
Application Number:
PCT/JP2022/007628
Publication Date:
September 01, 2022
Filing Date:
February 24, 2022
Export Citation:
Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
C08J3/22; C08J5/18; C08K3/04; C08L25/04; C08L67/00; C08L67/02; C08L101/00
Domestic Patent References:
| WO2019167854A1 | 2019-09-06 | |||
| WO2009075322A1 | 2009-06-18 | |||
| WO2017038949A1 | 2017-03-09 |
Foreign References:
| JP2011184681A | 2011-09-22 | |||
| JP2017512847A | 2017-05-25 | |||
| JP2016504470A | 2016-02-12 | |||
| JP2015134859A | 2015-07-27 | |||
| JP2010006856A | 2010-01-14 | |||
| JP2003100147A | 2003-04-04 | |||
| JP2018021117A | 2018-02-08 | |||
| JP2009197056A | 2009-09-03 | |||
| JP2005162814A | 2005-06-23 | |||
| US20090247039A1 | 2009-10-01 | |||
| JP2002290094A | 2002-10-04 | |||
| JP2019197048A | 2019-11-14 | |||
| JP2010155993A | 2010-07-15 | |||
| JP2010174223A | 2010-08-12 | |||
| JP2018070722A | 2018-05-10 | |||
| JP2019056035A | 2019-04-11 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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