RESIN COMPOSITION, MOLDED BODY, AND FILM

Title:

RESIN COMPOSITION, MOLDED BODY, AND FILM

Document Type and Number:

WIPO Patent Application WO/2023/249079

Kind Code:

A1

Abstract:

The resin composition contains a solvent-soluble polyimide and a solvent-soluble polyester resin. The polyester resin is composed of a dicarboxylic acid component and a glycol component and satisfies at least one of (A) and (B): (A) contains a glycol having four or more carbon atoms between two hydroxy groups as a glycol component; (B) contains an aliphatic dicarboxylic acid as a dicarboxylic acid component. The polyimide satisfies at least one of (1) and (2): (1) at least one of a diamine component and a tetracarboxylic dianhydride component has a fluorene skeleton; (2) the diamine component has a fluoroalkyl group and the tetracarboxylic dianhydride component has an ester bond.

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Inventors:

ISHIGURO FUMIYASU (JP)

Application Number:

PCT/JP2023/023144

Publication Date:

December 28, 2023

Filing Date:

June 22, 2023

Export Citation:

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Assignee:

KANEKA CORP (JP)

International Classes:

C08L79/08; C08G73/10; C08J5/18; C08L67/02

Domestic Patent References:

WO2016190105A1	2016-12-01
WO2021132279A1	2021-07-01
WO2020241523A1	2020-12-03