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Patent Searching and Data


Title:
RESIN COMPOSITION, RESIN MOLDED BODY AND METHOD FOR PRODUCING RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2018/225837
Kind Code:
A1
Abstract:
One embodiment of the present invention provides: a resin composition which contains a resin and a near-infrared absorbing dye represented by general formula (1); a resin molded body; and a method for producing a resin molded body. In general formula (1), each of ring A and ring B independently represents an aromatic ring or a heteroaromatic ring; each of XA and XB independently represents a monovalent substituent; each of GA and GB independently represents a monovalent substituent; kA represents an integer of 0-nA; kB represents an integer of 0-nB; nA represents the maximum integer number of GA, with which the ring A is able to be substituted; nB represents the maximum integer number of GB, with which the ring B is able to be substituted; XA and GA, and XB and GB may respectively combine with each other to form a ring; and in cases where a plurality of GA and a plurality of GB are present, the plurality of GA and the plurality of GB may respectively combine with each other to form a ring structure.

Inventors:
SASAKI DAISUKE (JP)
JIMBO YOSHIHIRO (JP)
Application Number:
PCT/JP2018/021932
Publication Date:
December 13, 2018
Filing Date:
June 07, 2018
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L101/00; C08K5/55; C08L67/00; C08L75/04; C08L77/00; C09B23/00; C09B67/20; C09K3/00
Domestic Patent References:
WO2016186050A12016-11-24
WO2015025779A12015-02-26
Foreign References:
JPS63235370A1988-09-30
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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