Title:
RESIN COMPOSITION, MOLDED OBJECT, AND FILM
Document Type and Number:
WIPO Patent Application WO/2023/149435
Kind Code:
A1
Abstract:
A resin composition comprising a polyimide and an acrylic resin, wherein the polyimide comprises an alicyclic tetracarboxylic dianhydride as at least some of a tetracarboxylic dianhydride component and a fluoroalkyl-substituted benzidine as a diamine component. The amount of the alicyclic tetracarboxylic dianhydride may be 10-100 mol% with respect to the whole tetracarboxylic dianhydride component of the polyimide. The degree of acetyl substitution of an acetylcellulose-based resin may be 2.4 or greater. The resin composition may comprise the polyimide and the acetylcellulose-based resin in a weight ratio in the range of 98:2 to 2:98.
Inventors:
ISHIGURO FUMIYASU (JP)
Application Number:
PCT/JP2023/003097
Publication Date:
August 10, 2023
Filing Date:
January 31, 2023
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08G73/10; C08J5/18; C08L1/12; C08L79/08
Domestic Patent References:
| WO2018225825A1 | 2018-12-13 | |||
| WO2012133143A1 | 2012-10-04 |
Foreign References:
| JP2019023249A | 2019-02-14 | |||
| JP2008045054A | 2008-02-28 | |||
| JP2005015629A | 2005-01-20 | |||
| JP2018028694A | 2018-02-22 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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