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Title:
POLISHING LAYER, POLISHING PAD, METHOD FOR MANUFACTURING POLISHING PAD, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/149434
Kind Code:
A1
Abstract:
A polishing layer containing polyurethane, the elongation at break of the polyurethane at a tension speed of 50mm/min after undergoing 50°C water-based saturation swelling being less than 100%; a polishing pad comprising said polishing layer and a method for manufacturing the polishing pad; and a polishing method using the polishing pad.

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Inventors:
SUNAYAMA AZUSA (JP)
GOSHI YUKO (JP)
KATO MITSURU (JP)
Application Number:
PCT/JP2023/003092
Publication Date:
August 10, 2023
Filing Date:
January 31, 2023
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
B24B37/24; C08G18/00; H01L21/304
Domestic Patent References:
WO2019216279A12019-11-14
Foreign References:
JP2017185566A2017-10-12
JP2008207325A2008-09-11
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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