Title:
RESIN COMPOSITION AND MOLDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2022/210323
Kind Code:
A1
Abstract:
Provided are: a resin composition capable of providing molded objects having toughness that enables the molded objects to sufficiently withstand heat and load; and a molded object. The resin composition comprises 50.0-80.0 parts by mass of (a) a poly(phenylene ether) resin, 50.0-20.0 parts by mass of (b) a polypropylene resin, the sum of (a) and (b) being 100 parts by mass, and 5.0-30.0 parts by mass of (c) a block copolymer, wherein the block copolymer (c) is a hydrogenated copolymer comprising a vinylaromatic compound block (c1) and an isoprene polymer block (c2), the content of vinylaromatic compound units in the block copolymer (c) being 50 mass% or higher but less than 80 mass%.
Inventors:
TAKANO YOICHI (JP)
YANAGISAWA KENICHI (JP)
MIYATA YOICHI (JP)
KUBO NAOTO (JP)
OKABE MAKI (JP)
YANAGISAWA KENICHI (JP)
MIYATA YOICHI (JP)
KUBO NAOTO (JP)
OKABE MAKI (JP)
Application Number:
PCT/JP2022/014241
Publication Date:
October 06, 2022
Filing Date:
March 25, 2022
Export Citation:
Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
SHINSEI KAGAKU KOGYO CO LTD (JP)
SHINSEI KAGAKU KOGYO CO LTD (JP)
International Classes:
C08L23/12; C08L25/06; C08L53/02; C08L71/12; H01M50/193
Foreign References:
| JP2000058007A | 2000-02-25 | |||
| JP2002060562A | 2002-02-26 | |||
| JP2002063873A | 2002-02-28 | |||
| JP2014177504A | 2014-09-25 | |||
| JPH02103246A | 1990-04-16 | |||
| JPH1171466A | 1999-03-16 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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