RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, SEMICONDUCTOR DEVICE, AND BASE GENERATOR

Title:

RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, SEMICONDUCTOR DEVICE, AND BASE GENERATOR

Document Type and Number:

WIPO Patent Application WO/2022/210324

Kind Code:

A1

Abstract:

Provided are: a resin composition including a precursor of a cyclized resin and a base generator, wherein the base generated by the base generator is a base that cyclizes within the same molecule and becomes a tertiary amine, and the base generated by the base generator is neither an α,β-unsaturated carbonyl compound nor an α,β-unsaturated imine compound; a cured product obtained by curing the resin composition; a laminate including the cured product; a method for producing the cured product; a semiconductor device including the cured product or the laminate; and a base generator.

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Inventors:

ASAKAWA DAISUKE (JP)

Application Number:

PCT/JP2022/014248

Publication Date:

October 06, 2022

Filing Date:

March 25, 2022

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

C07D211/22; C07D303/20; C07D305/06; C07D405/12; C07D409/12; C08F283/04; C08G73/10; C09K3/00; G03F7/004; G03F7/027; G03F7/20; G03F7/40

Foreign References:

JP2010133996A	2010-06-17
JP2012092329A	2012-05-17
JP2016090964A	2016-05-23
JP2014055114A	2014-03-27

Attorney, Agent or Firm:

SIKs & Co. (JP)

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