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Title:
RESIN COMPOSITION AND MOLDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2024/024662
Kind Code:
A1
Abstract:
Provided are a resin composition and a molded object. A resin composition comprising, with respect to 100 parts by mass of resin components including a polybutylene terephthalate resin, 2-15 parts by mass of an elastomer, 3-20 parts by mass of a hydroxyl group-containing compound, and 3-20 parts by mass of a conductive carbon, wherein the hydroxyl group-containing compound has, when being subjected to analysis using 1H NMR, a hydroxyl group concentration, which is the proportion of peak area derived from hydroxyl groups with respect to the total peak area and which is represented by [(hydroxyl group derived peak area / total peak area )×100], in a range of 0.5-15.0%.

Inventors:
MUTO FUMIHIRO (JP)
JOUDUKA TAKAO (JP)
TOKUMO KAZUAKI (JP)
Application Number:
PCT/JP2023/026744
Publication Date:
February 01, 2024
Filing Date:
July 21, 2023
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
NISSAN MOTOR (JP)
International Classes:
C08L67/02; C08K3/04; C08K5/49; C08L23/08; C08L51/04; C08L69/00; C08L101/02
Domestic Patent References:
WO2020054705A12020-03-19
WO2020230394A12020-11-19
Foreign References:
JP2020084133A2020-06-04
JP2018159003A2018-10-11
JPH07258557A1995-10-09
JP2014218551A2014-11-20
JP2006213766A2006-08-17
JPH07207135A1995-08-08
JPH01146949A1989-06-08
Attorney, Agent or Firm:
SIKS & CO. (JP)
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