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Title:
RESIN COMPOSITION FOR PLATING SUBSTRATE AND RESIN MOLDINGS USING THE SAME, AND METAL PLATED PARTS
Document Type and Number:
WIPO Patent Application WO/2002/102894
Kind Code:
A1
Abstract:
A resin composition for a plating substrate, characterized in that it comprises 100 parts by mass of a resin composition (C) comprising 10 to 60 mass % of a graft copolymer (A) prepared by the graft polymerization of a monomer component (A2) containing an aromatic alkenyl compound monomer unit (a) and a vinyl cyanide compound monomer unit (b)to a rubbery polymer (A1) and 40 to 90 mass % of another polymer (B)(provided that (A) &plus (B) = 100 mass %), and 5 to 40 parts by mass of a phosphate ester type flame retardant (D) having a molecular weight of greater than 326 or 2 to 40 parts by mass of a red phosphorus based flame retardant (D'). The resin composition for a plating substrate is good in the stability of processing such as moldability, in dimensional stability, in mechanical strength and in plating characteristics, and further is environmentally friendly. Excellent metal plated parts exhibiting good thermal conductivity which are suitable for a housing of a notebook PC or a portable device can be provided through processing the resin composition for a plating substrate to prepare resin moldings, and forming a metal plating layer on the resultant resin moldings.

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Inventors:
TEZUKA KOUICHI (JP)
FUJII SEIZO (JP)
Application Number:
PCT/JP2002/005189
Publication Date:
December 27, 2002
Filing Date:
May 29, 2002
Export Citation:
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Assignee:
MITSUBISHI RAYON CO (JP)
TEZUKA KOUICHI (JP)
FUJII SEIZO (JP)
International Classes:
C08F257/02; C08F265/04; C08F279/02; C08F279/04; C08F283/12; C08F291/00; C08K3/02; C08K5/521; C08K5/523; C08L51/00; C08L51/04; C08L51/08; C08L55/02; C08L67/00; C08L69/00; C08L77/00; C08L77/02; C08L77/06; C09D151/00; C25D5/56; C08K3/04; C08L67/02; (IPC1-7): C08L51/04; C08L101/00; C08K5/521; C25D5/56
Foreign References:
JPH10130485A1998-05-19
JPH08193157A1996-07-30
Attorney, Agent or Firm:
Shiga, Masatake (2-3-1 Yaesu Chuo-ku, Tokyo, JP)
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