Title:
RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAMINATED BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/145471
Kind Code:
A1
Abstract:
A resin composition according to the present invention contains: a molybdenum compound (A); a curable resin (B) that includes a maleimide compound (B1) and a benzoxazine compound (B2) having an allyl group; and an inorganic filler (C). The molybdenum compound (A) contains molybdenum compound particles that have been surface treated with a surfactant.
Inventors:
ISHIKAWA YUICHI
INOUE HIROHARU
INOUE HIROHARU
Application Number:
PCT/JP2023/000640
Publication Date:
August 03, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L79/00; B32B5/28; B32B15/08; C08J5/24; C08K3/013; C08K7/18; C08K9/04; H01B3/30; H01B5/14; H05K1/03
Domestic Patent References:
| WO2021192680A1 | 2021-09-30 | |||
| WO2017170643A1 | 2017-10-05 | |||
| WO2017006896A1 | 2017-01-12 | |||
| WO2011078339A1 | 2011-06-30 | |||
| WO2020155291A1 | 2020-08-06 |
Foreign References:
| JP2019099755A | 2019-06-24 | |||
| JP2020158705A | 2020-10-01 | |||
| JP2016074871A | 2016-05-12 | |||
| US20210371657A1 | 2021-12-02 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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