Title:
RESIN COMPOSITION, PREPREG, RESIN-BEARING FILM, RESIN-BEARING METAL FOIL, METAL-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/145472
Kind Code:
A1
Abstract:
This resin composition comprises: a curable resin (A); an acrylic monomer copolymer (B) having structures represented by formulas (1) to (3) and having a weight-average molecular weight of at least 10,000 and not more than 900,000; an inorganic filler (C) having a molybdenum compound present at least at a portion of the surface; and an inorganic filler (D) different from the inorganic filler (C). In formulas (1) to (3), x, y, and z represent mole fractions and satisfy x + y + z ≤ 1, 0 < x ≤ 0.2, 0.6 ≤ y ≤ 0.95, and 0.05 ≤ z ≤ 0.2. R1 is a hydrogen atom or methyl group and R2 is a hydrogen atom, alkyl group, glycidyl group, or epoxidized alkyl group and includes at least one of the glycidyl group and epoxidized alkyl groups. R3 is a hydrogen atom or methyl group and R4 is Ph (phenyl group), -COOCH2Ph, or -COO(CH2)2Ph.
Inventors:
HONMA MASAFUMI
TAKAHASHI RYUJI
WASHIO TEPPEI
ISHIKAWA YUICHI
MIDORIKAWA HIROFUMI
TAKAHASHI RYUJI
WASHIO TEPPEI
ISHIKAWA YUICHI
MIDORIKAWA HIROFUMI
Application Number:
PCT/JP2023/000642
Publication Date:
August 03, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L101/00; B32B5/28; B32B15/04; C08J5/24; C08K3/013; C08K3/24; C08L21/00; C08L33/00; C08L61/10; C08L63/00; C08L79/00; H01B5/14; H05K1/03
Domestic Patent References:
| WO2021261306A1 | 2021-12-30 | |||
| WO2021010232A1 | 2021-01-21 |
Foreign References:
| JP2018100327A | 2018-06-28 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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