Title:
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/009830
Kind Code:
A1
Abstract:
One aspect of the present invention is a resin composition containing: a maleimide compound (A) that has a benzene ring in a molecule thereof and also has a maleimide equivalent of 500 g/mol or less; an imide compound (B) that has at least one of a hydrocarbon group and a maleimide group at a molecular end; and a radically polymerizable compound (C) that has, in a molecule thereof, a benzene ring to which an alkenyl group is bonded and also has a weight-average molecular weight of 1,000 or less.
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Inventors:
SAITO HIROSUKE
OTSUKA HAJIME
OTSUKA HAJIME
Application Number:
PCT/JP2023/023667
Publication Date:
January 11, 2024
Filing Date:
June 26, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L79/08; C08F283/04; C08G14/14; C08G73/10; C08J5/04; C08K5/3415; H05K1/03
Domestic Patent References:
| WO2008010514A1 | 2008-01-24 |
Foreign References:
| JPH06157905A | 1994-06-07 | |||
| JP2021014577A | 2021-02-12 | |||
| JP2022097398A | 2022-06-30 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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