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Patent Searching and Data


Title:
RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2020/237634
Kind Code:
A1
Abstract:
Provided is a resin composition, comprising: a modified maleimide resin (A), an active ester resin (B), and an epoxy resin (C); the modified maleimide resin (A) is obtained by means of reacting a maleimide compound (M) having at least two maleimide groups/molecules with an amine compound (N1) having at least one primary amine group/molecule and an amine compound (N2) having at least two primary amine groups/molecules, and the molecular weight distribution is: molecules having a molecular weight between 1000 and 4500 account for 25-60% the total number of molecules.

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Inventors:
LI HONGJIE (CN)
TANG JUNQI (CN)
Application Number:
PCT/CN2019/089557
Publication Date:
December 03, 2020
Filing Date:
May 31, 2019
Export Citation:
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Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08K3/36; C08L63/00; C08K7/00; C08K7/18; C08L79/08
Foreign References:
CN110218415A2019-09-10
CN109810467A2019-05-28
CN103992621A2014-08-20
JP2010090238A2010-04-22
JP2013234328A2013-11-21
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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