Title:
RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/163086
Kind Code:
A1
Abstract:
The present invention relates to: a resin composition containing (A) a thermosetting resin and (B) a copolymer resin containing structural units derived from an aromatic vinyl compound and structural units derived from an unsaturated aliphatic hydrocarbon, the component (B) being such that the content value for the structural units derived from an aromatic vinyl compound (B1) is 25-60 mass% and the content value, in terms of mass, of the structural units derived from an aromatic vinyl compound (B2) is less than that for the component (B1), and the component (B1) content of the resin composition being greater, in terms of mass, than the component (B2) content of the resin composition; and a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package in which said resin composition is used.
Inventors:
SATO NAOYOSHI (JP)
TANIGAWA TAKAO (JP)
FUKUI MASATO (JP)
AKEBI RYUJI (JP)
TAKEGUCHI AYAKA (JP)
TANIGAWA TAKAO (JP)
FUKUI MASATO (JP)
AKEBI RYUJI (JP)
TAKEGUCHI AYAKA (JP)
Application Number:
PCT/JP2023/006630
Publication Date:
August 31, 2023
Filing Date:
February 24, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08L101/00; B32B15/082; B32B27/30; C08J5/24; C08L9/00; C08L35/00; C08L53/02; H01L23/29; H01L23/31
Foreign References:
| JPH06157851A | 1994-06-07 | |||
| JP2007302877A | 2007-11-22 | |||
| JP2019006879A | 2019-01-17 | |||
| JP2018150541A | 2018-09-27 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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