RESIN COMPOSITION, PREPREG, AND LAYERED PRODUCT

Title:

RESIN COMPOSITION, PREPREG, AND LAYERED PRODUCT

Document Type and Number:

WIPO Patent Application WO/2002/098974

Kind Code:

A1

Abstract:

A curable resin composition comprising 100 parts by weight of an alicyclic olefin polymer ingredient and 10 to 90 parts by weight of a thermosetting ingredient, characterized in that (1) at least one of the polymers constituting the alicyclic olefin polymer ingredient has polar groups and (2) at least one of the polymers constituting the alicyclic olefin polymer ingredient has a weight−average molecular weight Mw of 5,000 to 50,000, excluding 50,000.

More Like This:

JPS60133037	LOW DENSITY POLYBUTADIENE BASE WET FILAMENT WOUND RESIN
JP6492455	Curable composition, cured product, semiconductor encapsulant material, semiconductor device, prepreg, printed circuit board, flexible wiring board, build-up film, build-up board, fiber-reinforced composite material, molded product

Inventors:

TAKEUCHI HITOMI (JP)
SHIMIZU HITOSHI (JP)
TAKANO FUMIO (JP)

Application Number:

PCT/JP2002/005352

Publication Date:

December 12, 2002

Filing Date:

May 31, 2002

Export Citation:

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Assignee:

ZEON CORP (JP)
TAKEUCHI HITOMI (JP)
SHIMIZU HITOSHI (JP)
TAKANO FUMIO (JP)

International Classes:

C08J5/24; C08L45/00; C08L65/00; H05K1/03; (IPC1-7): C08L45/00; C08J5/24; C08L65/00

Domestic Patent References:

WO1998015595A1	1998-04-16
WO1999052980A1	1999-10-21

Foreign References:

JP2001139777A	2001-05-22
JP2001098026A	2001-04-10
JPH0820692A	1996-01-23
JPS4744028B1

Attorney, Agent or Firm:

Wada, Yasuro c/o ZEON CORPORATION (6-1 Marunouchi 2-chome Chiyoda-ku, Tokyo, JP)

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