Title:
RESIN COMPOSITION FOR PREPREGS, PREPREG AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/199692
Kind Code:
A1
Abstract:
The present invention provides: a resin composition for prepregs, the resin composition enabling the achievement of a molded article that has both impact resistance and heat resistance in a highly balanced manner; a prepreg; and a molded article of the prepreg. The present invention uses a resin composition for prepregs, the resin composition essentially containing (A) a urethane (meth)acrylate which is a reaction product of a polyisocyanate (a1), a polyol (a2) and a hydroxy alkyl (meth)acrylate (a3), (B) a polymerization initiator, (C) a polyester resin, and (D) a thermoplastic resin other than the polyester resin (C).
Inventors:
KATOU NAOKI (JP)
SHINCHI TOMOAKI (JP)
SHINCHI TOMOAKI (JP)
Application Number:
PCT/JP2023/010216
Publication Date:
October 19, 2023
Filing Date:
March 16, 2023
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08J5/24; C08F299/06
Domestic Patent References:
| WO2021006163A1 | 2021-01-14 | |||
| WO2021131566A1 | 2021-07-01 | |||
| WO2019065210A1 | 2019-04-04 |
Foreign References:
| JP2020139000A | 2020-09-03 | |||
| JPH09169862A | 1997-06-30 | |||
| JP2004238755A | 2004-08-26 | |||
| JP2004231848A | 2004-08-19 |
Attorney, Agent or Firm:
ONO Takayuki (JP)
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