Title:
RESIN COMPOSITION FOR SEALANT FILM, SEALANT FILM, MULTILAYERED FILM, AND METHOD FOR PRODUCING SEALANT FILM
Document Type and Number:
WIPO Patent Application WO/2023/171155
Kind Code:
A1
Abstract:
The problem addressed is to provide a resin composition for a sealant film capable of yielding a sealant film having relatively excellent retort adhesion resistance, a sealant film containing said resin composition for a sealant film, a multilayered film equipped with said sealant film, and a method for producing a sealant film using the resin composition for a sealant film. The resin composition for a sealant film according to the present invention contains: a propylene polymer (1) containing 98 mass% or more of structural units derived from propylene; a propylene copolymer (2) containing from more than 40 mass% to less than 90 mass% of structural units derived from propylene and from more than 10 mass% to less than 60 mass% of structural units derived from at least one selected from the group consisting of ethylene and C4-12 α-olefins; and a β crystal nucleating agent.
Inventors:
KOSAKA AKIRA (JP)
ONISHI KENSUKE (JP)
INOUE NAO (JP)
ONISHI KENSUKE (JP)
INOUE NAO (JP)
Application Number:
PCT/JP2023/001862
Publication Date:
September 14, 2023
Filing Date:
January 23, 2023
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
B32B27/32; C08L23/10; C08J5/18; C08L23/08
Foreign References:
| JP2015203065A | 2015-11-16 | |||
| JP2008255191A | 2008-10-23 | |||
| JP2017036386A | 2017-02-16 | |||
| JP2013209635A | 2013-10-10 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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