Title:
RESIN COMPOSITION, RESIN SHEET, RESIN SHEET WITH CONDUCTOR LAYER, MULTILAYER SUBSTRATE AND METHOD FOR PRODUCING RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2024/004620
Kind Code:
A1
Abstract:
A resin composition 1s according to the present invention contains a liquid crystal polymer 1g and an inorganic filler 1h; the specific surface area of the inorganic filler 1h is 30 m2/cm3 or less; the maximum diameter of the inorganic filler 1h is 100 µm or less; and the content ratio of the inorganic filler 1h is 0.1 vol% to 60 vol%.
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Inventors:
ROKUSHA YUKI (JP)
Application Number:
PCT/JP2023/021829
Publication Date:
January 04, 2024
Filing Date:
June 13, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
C08L67/00; B32B15/08; C08K3/013; H01B5/14
Domestic Patent References:
| WO2021095662A1 | 2021-05-20 | |||
| WO2007043701A1 | 2007-04-19 | |||
| WO2022065270A1 | 2022-03-31 |
Foreign References:
| JP2013199625A | 2013-10-03 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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