Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/004621
Kind Code:
A1
Abstract:
The present invention determines damage and defects of substrates on a per-processing-tank basis. This substrate processing method is for controlling a substrate processing device, wherein the substrate processing device includes: a processing tank that holds a processing solution into which a plurality of substrates are immersed and subjected to batch processing; and a substrate holding mechanism that has the function of holding the plurality of substrates en bloc, and that has a first function for removing the plurality of substrates from the processing solution and a second function for immersing the plurality of substrates into the processing solution. The method determines the presence of a deficiency of the plurality of substrates in the processing that uses the processing tank, on the basis of a load applied to the substrate holding mechanism when performing the first function.
Inventors:
SHIBATA TETSUYA (JP)
Application Number:
PCT/JP2023/021830
Publication Date:
January 04, 2024
Filing Date:
June 13, 2023
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/677
Foreign References:
| JPH10313038A | 1998-11-24 | |||
| JPH05315309A | 1993-11-26 | |||
| JP2001332603A | 2001-11-30 | |||
| JP2012108290A | 2012-06-07 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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