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Patent Searching and Data


Title:
RESIN COMPOSITION FOR WIRE COVERING MATERIALS, INSULATED WIRE AND WIRING HARNESS
Document Type and Number:
WIPO Patent Application WO/2014/203701
Kind Code:
A1
Abstract:
Provided are: a resin composition for wire covering materials, which has excellent oil resistance at high temperatures, excellent wear resistance and excellent elongation; an insulated wire which uses this resin composition as a covering material; and a wiring harness. A resin composition for wire covering materials, which is obtained by blending (A) a polysulfone resin, (B) an aromatic polyester resin, (C) a polyester elastomer and (D) a compound having a reactive functional group that is reactive with a carboxyl group or a hydroxyl group. In this resin composition for wire covering materials, the component (D) reacts with the component (B) or the component (C) and forms a bond.

Inventors:
FURUKAWA TOYOKI (JP)
MURAO SATOSHI (JP)
Application Number:
PCT/JP2014/064250
Publication Date:
December 24, 2014
Filing Date:
May 29, 2014
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
C08L67/00; H01B3/30; C08L81/06; H01B3/42; H01B7/00; H01B7/02
Domestic Patent References:
WO2012090921A12012-07-05
WO2013168525A12013-11-14
Foreign References:
JP2013120664A2013-06-17
JPH0216158A1990-01-19
JPH0439355A1992-02-10
JPH07331043A1995-12-19
JPH07173394A1995-07-11
Attorney, Agent or Firm:
UENO, NOBORU (JP)
Ueno 登 (JP)
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