Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2008/044766
Kind Code:
A1
Abstract:
Disclosed is a resin composition having low thermal expansion, which enables to form a plated conductive layer with sufficient adhesion strength, while suppressing roughness of an insulating layer surface (namely, ensuring low surface roughness of an insulating layer) during a wet roughening process. Specifically disclosed is a resin composition characterized by containing a cyanate ester resin and a naphthol epoxy resin represented by the following formula (1). (In the formula, n represents a number having an average of 1-6; X represents a glycidyl group or a hydrocarbon group having 1-8 carbon atoms; and the ratio of hydrocarbon group/glycidyl group is within the range of 0.05-2.0.)
Inventors:
NAKAMURA SHIGEO (JP)
Application Number:
PCT/JP2007/069951
Publication Date:
April 17, 2008
Filing Date:
October 12, 2007
Export Citation:
Assignee:
AJINOMOTO KK (JP)
NAKAMURA SHIGEO (JP)
NAKAMURA SHIGEO (JP)
International Classes:
C08G59/40; B32B27/38; C08G59/20; C08J5/24; C08K3/36; C08L63/00; C08L87/00; H05K3/46
Domestic Patent References:
| WO2003099952A1 | 2003-12-04 |
Foreign References:
| JP2003246842A | 2003-09-05 | |||
| JP2003212970A | 2003-07-30 | |||
| JP2005240019A | 2005-09-08 | |||
| JP2002050661A | 2002-02-15 |
Attorney, Agent or Firm:
TAKASHIMA, Hajime (1-1 Fushimimachi 4-chome, Chuo-k, Osaka-shi Osaka 44, JP)
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