Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/194107
Kind Code:
A1
Abstract:
Provided is a novel resin composition having excellent heat resistance, and which is suitable for use as a material for insulating films in electronic components and the like. The resin composition contains: a compound (a) represented by formula (1); a resin (b) having a hydrogen-bonding group; and a polymerization initiator (c). (In formula (1), A is a divalent organic group, Y is a C1-18 straight-chain alkylene or branched alkylene, if said alkylene has 2 or more carbon atoms an oxygen atom (-O-) may be inserted into an arbitrarily-defined C-C bond, -CO- may be inserted into a terminal C-N bond, m is 0 or 1, and X is a group represented by formula (2).) (In formula (2), R1 and R2 are independently hydrogen or methyl.)
Inventors:
YOHDA MASAAKI (JP)
YASUI PING (JP)
OIKAWA HISAO (JP)
YAMAHIRO MIKIO (JP)
YASUI PING (JP)
OIKAWA HISAO (JP)
YAMAHIRO MIKIO (JP)
Application Number:
PCT/JP2019/014293
Publication Date:
October 10, 2019
Filing Date:
March 29, 2019
Export Citation:
Assignee:
JNC CORP (JP)
International Classes:
C08F20/36; C07F7/10; C08F299/06; C08L83/04; C09D4/02; C09D175/02; C09D183/04
Domestic Patent References:
| WO2017150039A1 | 2017-09-08 | |||
| WO2018235549A1 | 2018-12-27 |
Foreign References:
| JP2007055993A | 2007-03-08 | |||
| JP2010189294A | 2010-09-02 | |||
| JP2007169375A | 2007-07-05 | |||
| JP2012009796A | 2012-01-12 | |||
| JP2008088251A | 2008-04-17 | |||
| JP2011079926A | 2011-04-21 |
Attorney, Agent or Firm:
OKUBO, Katsuyuki (JP)
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