Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/048740
Kind Code:
A1
Abstract:
Provided is a polyimide film which achieves a balance in the properties of chemical resistance, Young's modulus, YI (yellowness), and glass transition temperature when curing is carried out at a temperature of not lower than 430°C, and which is applicable to a display process for LTPS (low-temperature polysilicon) displays, LTPO (low-temperature polycrystalline oxide) displays, and the like. Also provided are, for example, a resin composition and a laminate for forming the polyimide film. The present invention comprises a resin including a structural unit represented by general formula (1) and/or a structural unit represented by general formula (2), wherein the resin is a block copolymer including a first block and a second block, the first block includes a structural unit derived from a compound represented by general formula (4), and the second block includes a structural unit derived from at least one compound selected from compounds represented by general formulae (6) and (7).
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Inventors:
MAITANI MASAKI (JP)
YORISUE TOMOHIRO (JP)
ADACHI MARIA (JP)
OKUDA TOSHIAKI (JP)
KANADA TAKAYUKI (JP)
YORISUE TOMOHIRO (JP)
ADACHI MARIA (JP)
OKUDA TOSHIAKI (JP)
KANADA TAKAYUKI (JP)
Application Number:
PCT/JP2023/031871
Publication Date:
March 07, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
C08G73/10; G02F1/1333; G09F9/00; G09F9/30; H05B33/02; H05B33/10; H10K50/10; H10K59/00
Domestic Patent References:
| WO2022211086A1 | 2022-10-06 |
Foreign References:
| JP2008189694A | 2008-08-21 | |||
| JP2006133510A | 2006-05-25 | |||
| JPH08208835A | 1996-08-13 | |||
| JPH04306232A | 1992-10-29 | |||
| CN105906813A | 2016-08-31 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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