RESIN FILM AND METHOD FOR MANUFACTURING RESIN FILM

WIPO Patent Application WO/2022/014210

A1

Provided is a resin film that has excellent heat resistance, has a linear coefficient of expansion that is low up to a high-temperature region, has a high tensile modulus of elasticity, has a low ratio in terms of the linear coefficients of expansion in the MD direction and the TD direction of the resin film and the tensile modulus of elasticity, and has satisfactory isotropy in terms of the properties thereof.　The resin film satisfies items (1)-(2) below.　(1) The temperature (A) at which a temperature dependence curve of tan δ, which is a value where the loss elastic modulus has been divided by the storage modulus of elasticity, reaches a peak is within the range of 250 to 500°C, and the temperature (A) at which the temperature dependence curve of tan δ reaches the peak and the linear coefficient of expansion inflection temperature (B) are related as indicated in the following formula: (40+0.8×A)≤B