Title:
RESIN LAMINATE FOR PACKAGING MATERIALS
Document Type and Number:
WIPO Patent Application WO/2023/074473
Kind Code:
A1
Abstract:
[Problem] To provide a highly processable resin laminate for packaging materials, that is characterized in that a substrate layer and a sealant layer comprise the same material. [Solution] A resin laminate for packaging materials that is a resin laminate comprising at least a substrate layer and a sealant layer, wherein the main components of the resin compositions constituting the substrate layer and the sealant layer are composed of the same resin composition, and wherein the fusion initiation temperature (FIT-B) of the substrate layer and the seal initiation temperature (SIT-S) of the sealant layer satisfy formulas (1) to (3). Formula (1): 50°C ≤ (FIT-B) - (SIT-S) ≤ 90 (°C); Formula (2): 90 ≤ (SIT-S) ≤ 120 (°C); Formula (3): 160 ≤ (FIT-B) ≤ 180 (°C)
Inventors:
IMAI TORU (JP)
TANEKI KENSUKE (JP)
HAMANO AKITO (JP)
TAGA ATSUSHI (JP)
TANEKI KENSUKE (JP)
HAMANO AKITO (JP)
TAGA ATSUSHI (JP)
Application Number:
PCT/JP2022/038787
Publication Date:
May 04, 2023
Filing Date:
October 18, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B7/027; B32B27/00; B32B27/32; B65D65/40
Domestic Patent References:
| WO2019244708A1 | 2019-12-26 |
Foreign References:
| JP2000025176A | 2000-01-25 | |||
| JP2018167487A | 2018-11-01 | |||
| JP2006187939A | 2006-07-20 |
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