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Title:
FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, ADHESIVE TAPE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/074474
Kind Code:
A1
Abstract:
The present invention provides a film-like adhesive 1 for semiconductors, the film-like adhesive 1 comprising a first adhesive region 2 and a second adhesive region 3 in the thickness direction. With respect to this film-like adhesive 1 for semiconductors, the first adhesive region 2 has photocurable properties and thermosetting properties; and the second adhesive region 3 has thermosetting properties, but does not have photocurable properties.

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Inventors:
ISHIGE HIROYUKI (JP)
KIMURA RYOSUKE (JP)
SATO MAKOTO (JP)
OHKUBO KEISUKE (JP)
Application Number:
PCT/JP2022/038799
Publication Date:
May 04, 2023
Filing Date:
October 18, 2022
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
C09J7/30; C09J4/02; C09J7/38; C09J11/06; C09J163/00; C09J201/00; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
WO2014021457A12014-02-06
WO2019050006A12019-03-14
WO2020100696A12020-05-22
WO2021251386A12021-12-16
WO2022009846A12022-01-13
Foreign References:
JP2013058412A2013-03-28
JP2008294382A2008-12-04
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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