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Patent Searching and Data


Title:
RESIN LAYER FORMING METHOD, RESIN LAYER FORMING APPARATUS, DISC AND DISC MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2005/118159
Kind Code:
A1
Abstract:
A resin layer forming method and a resin layer forming apparatus, which can uniformize a resin layer on a board prior to lamination or on a board to be coated, by simple procedures, and a disc and a disc manufacturing method. An adhesive (A) is applied on an inner circumference side by rotating a board (P) at a low speed. A first adhesive layer (AL1) is formed on a surface of the board (P) by rotating the board (P) at a high speed. A step part (H) is formed on the circumference of a rotating center of the board (P) by irradiating the inner circumference side of the first adhesive layer (AL1) with ultraviolet rays and hardening the area. The adhesive (A) is applied on a side closer to the rotation center side of the board (P) than the step part (H), and a second adhesive layer (AL2) is formed on the first adhesive layer (AL1) by rotating the board (P) at a high speed. The first adhesive layer (AL1) and the second adhesive layer (AL2) are integrated to form a uniform adhesive layer (B) as a whole.

Inventors:
ITO TOMOKAZU (JP)
NISHIGAKI HISASHI (JP)
KAWAKAMI TSUKASA (JP)
NARITA HARUKA (JP)
TAKIZAWA YOJI (JP)
HANADA TAKUMI (JP)
IWAMI MUNENORI (JP)
Application Number:
PCT/JP2005/010061
Publication Date:
December 15, 2005
Filing Date:
June 01, 2005
Export Citation:
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Assignee:
SHIBAURA MECHATRONICS CORP (JP)
ITO TOMOKAZU (JP)
NISHIGAKI HISASHI (JP)
KAWAKAMI TSUKASA (JP)
NARITA HARUKA (JP)
TAKIZAWA YOJI (JP)
HANADA TAKUMI (JP)
IWAMI MUNENORI (JP)
International Classes:
B05C9/08; B05C11/08; B05D1/40; G11B7/24024; G11B7/26; (IPC1-7): B05D1/40; B05C9/08; B05C11/08; G11B7/24; G11B7/26
Foreign References:
JP2000513654A2000-10-17
JP2004362693A2004-12-24
JPH05337434A1993-12-21
JP2004130298A2004-04-30
Attorney, Agent or Firm:
Kiuchi, Mitsuharu (Toranomon-Yoshiara Bldg. 6-13, Nishi-Shinbashi 1-chom, Minato-ku Tokyo 03, JP)
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