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Patent Searching and Data


Title:
RESIN MOLDING DEVICE AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/100423
Kind Code:
A1
Abstract:
This resin molding device (30) comprises: a mold (C) having an upper mold (UM) and a lower mold (LM); a mold clamping mechanism (35) that clamps the mold (C); and a film supply mechanism (1) that supplies a release film (F) between the upper mold (UM) and the lower mold (LM) and has a delivery mechanism (11) including a delivery roll (11a) that delivers the release film (F), and a film conveyance mechanism (7) that conveys the release film (F); and a control unit (6) that controls an operation of the film supply mechanism (1), wherein, when the film conveyance mechanism (7) conveys the release film (F), the control unit (6) rotates the delivery roll (11a) in the same direction as the direction in which the film conveyance mechanism (7) conveys the release film (F).

Inventors:
ICHIHASHI HIDEO (JP)
Application Number:
PCT/JP2022/031382
Publication Date:
June 08, 2023
Filing Date:
August 19, 2022
Export Citation:
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Assignee:
TOWA CORP (JP)
International Classes:
B29C31/04; B29C45/02; B29C33/44; B29C43/34; H01L21/56
Foreign References:
JP2016100375A2016-05-30
JP2003174049A2003-06-20
JP2017183443A2017-10-05
JP2021014017A2021-02-12
JP2008188798A2008-08-21
JP2007250681A2007-09-27
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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