Title:
RESIN MOLDING MATERIAL, MOLDED BODY, AND METHOD FOR PRODUCING SAID MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2022/075186
Kind Code:
A1
Abstract:
The resin molding material of the present invention is used in transfer molding or compression molding, contains (A) soft magnetic particles, (B) a silicone compound that is liquid at normal temperature (25°C), and (C) a thermosetting resin, and has a content of soft magnetic particles (A) of 96 mass% or higher.
Inventors:
YAMASHITA KATSUSHI (JP)
NOTSU KENSUKE (JP)
NOTSU KENSUKE (JP)
Application Number:
PCT/JP2021/036198
Publication Date:
April 14, 2022
Filing Date:
September 30, 2021
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08G59/06; C08G59/62; C08G59/68; C08K3/08; C08L63/00; C08L83/04; C08L101/00; H01F1/26
Domestic Patent References:
| WO2021112135A1 | 2021-06-10 | |||
| WO2019229960A1 | 2019-12-05 |
Foreign References:
| JP2017073479A | 2017-04-13 | |||
| JP2013243268A | 2013-12-05 | |||
| JP2019210447A | 2019-12-12 | |||
| JP2014062173A | 2014-04-10 | |||
| JP2009074159A | 2009-04-09 | |||
| JP2020114939A | 2020-07-30 | |||
| JP2020168308A | 2020-10-15 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
Download PDF:
Previous Patent: METHOD FOR PRODUCING EXTRACT COMPOSITION
Next Patent: VEHICLE DRIVING ASSISTANCE DEVICE
Next Patent: VEHICLE DRIVING ASSISTANCE DEVICE