Title:
RESIN MULTILAYER SUBSTRATE, ELECTRONIC COMPONENT, AND MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/098012
Kind Code:
A1
Abstract:
A resin multilayer substrate that has: a plurality of insulating resin base material layers (L1, L2, L3); and a plurality of conductor patterns that are formed on the plurality of insulating resin base material layers (L1, L2, L3). The plurality of conductor patterns include: a plurality of signal lines (11, 12) that are formed in locations that do not overlap as seen from the lamination direction of the insulating resin base material layers; and ground conductors (21, 22) that overlap the plurality of signal lines (11, 12) as seen from the lamination direction. Openings (A1, A2) are formed in the ground conductors (21, 22) such that the open area is greater in an inside zone (ZI) that, as seen from the lamination direction, is sandwiched between the two signal lines (11, 12) than in zones (ZO) that, as seen from the lamination direction, are outside the two signal lines (11, 12).
Inventors:
KOYAMA HIROMASA (JP)
Application Number:
PCT/JP2018/040303
Publication Date:
May 23, 2019
Filing Date:
October 30, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H05K3/46
Foreign References:
| JP2008172151A | 2008-07-24 | |||
| JP2011066293A | 2011-03-31 | |||
| JP2009302506A | 2009-12-24 | |||
| JP2005353835A | 2005-12-22 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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