Title:
RESIN MULTILAYER SUBSTRATE, ELECTRONIC COMPONENT, AND MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/098011
Kind Code:
A1
Abstract:
A resin multilayer substrate that has: a plurality of insulating resin base material layers (L1, L2, L3); and a plurality of conductor patterns that are formed on the plurality of insulating resin base material layers (L1, L2, L3). The plurality of conductor patterns include: a signal line (11); and ground conductors (21, 22) that overlap the signal line (11) as seen from the lamination direction of the insulating resin base material layers. A plurality of openings (A1, A2) are formed in the ground conductors (21, 22) such that the open area is greater in zones (ZF) that are far from the signal line (11) in a direction that is orthogonal to the lamination direction than in zones (ZN) that are near.
Inventors:
KOYAMA HIROMASA (JP)
Application Number:
PCT/JP2018/040299
Publication Date:
May 23, 2019
Filing Date:
October 30, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H05K3/46
Domestic Patent References:
| WO2011018979A1 | 2011-02-17 |
Foreign References:
| JP2005353835A | 2005-12-22 | |||
| JP2006024618A | 2006-01-26 | |||
| JP2011066293A | 2011-03-31 | |||
| JP2009302506A | 2009-12-24 | |||
| JPH10335535A | 1998-12-18 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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