RESIN MULTILAYER SUBSTRATE AND METHOD FOR PRODUCING RESIN MULTILAYER SUBSTRATE

WIPO Patent Application WO/2020/203724

A1

A resin multilayer substrate (101) comprises: a laminated body (10) formed by laminating a plurality of resin layers (11, 12); a first planar conductor (external conductor (41)) formed in the resin layer (12); and an interlayer-connecting conductor formed in the resin layer (12). The interlayer-connecting conductor includes a first interlayer-connecting conductor (V1) connected to the external conductor (41), and a second interlayer-connecting conductor (V2) bonded to the first interlayer-connecting conductor (V1) and to a planar conductor (31). The second interlayer-connecting conductor (V2) is made from a material different from the first interlayer-connecting conductor (V1). The second interlayer-connecting conductor (V2) includes, between a bonded portion of the first interlayer-connecting conductor (V1) and a bonded portion of the planar conductor (31), a constricted portion (CP) with a planar cross-sectional area smaller than the other portions.

JP2004214533	LAND PATTERN STRUCTURE AND SUBSTRATE FOR MOUNTING ELECTRIC COMPONENT
JPH10190174	PRINTED WIRING BOARD

OKAMOTO MASANORI (JP)
OSUGA TAKESHI (JP)

PCT/JP2020/013909

October 08, 2020

March 27, 2020

Click for automatic bibliography generation  

MURATA MANUFACTURING CO (JP)

H05K1/11; H05K3/40; H05K3/46

WO2011058938A1

2011-05-19

JP2010123829A	2010-06-03
JP2009188146A	2009-08-20
JP2006253189A	2006-09-21
JP2004273575A	2004-09-30

KAEDE PATENT ATTORNEYS' OFFICE (JP)

View/Download PDF      PDF Help

Previous Patent: WATER ABSORBENT RESIN AND WATER STOP MATERIAL

Next Patent: CONNECTION STRUCTURE FOR SUBSTRATE AND CARBON NANOTUBE WIRE