Title:
RESIN SEALING DEVICE AND SEALING MOLD
Document Type and Number:
WIPO Patent Application WO/2023/105841
Kind Code:
A1
Abstract:
The present invention is capable of absorbing thickness variation of a workpiece, and performs molding that enables a molded article to have a constant total thickness. As a solution, a sealing mold (202) according to the present invention comprises: a pot (240) in a lower mold (206); a cull block (244), in which a cull (246) is bored, in an upper mold (204); a first workpiece holding part (205A) and a second workpiece holding part (205B) in one of the lower mold (206) and the upper mold (204); one or more first cavities (208A) and one or more second cavities (208B) in the other one of the lower mold (206) and the upper mold (204); a first cavity piece (226A) and a first clamper (228A), which constitute each of the first cavities (208A); a first clamper spring (232A) which urges the first clamper (228A); a second cavity piece (226B) and a second clamper (228B), which constitute each of the second cavities (208B); and a second clamper spring (232B) which urges the second clamper (228B).
Inventors:
KAWAGUCHI MAKOTO (JP)
Application Number:
PCT/JP2022/028425
Publication Date:
June 15, 2023
Filing Date:
July 22, 2022
Export Citation:
Assignee:
APIC YAMADA CORP (JP)
International Classes:
B29C33/12; B29C45/02; B29C45/37; H01L21/56
Foreign References:
| JP2016167583A | 2016-09-15 | |||
| JP2012146770A | 2012-08-02 |
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
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