Title:
RESIN SEALING DEVICE AND SEALING MOLD
Document Type and Number:
WIPO Patent Application WO/2023/105840
Kind Code:
A1
Abstract:
The present invention makes it possible to absorb variations in both workpiece thickness and resin quantity, and facilitates adjustment of workpiece clamping force and molding pressure. As a solution, in a sealing mold (202) according to the present invention, one workpiece holding part (205) for holding a plurality of workpieces (W) is provided to one of an upper mold (204) or a lower mold (206), and to the other of the two molds are provided a plurality of clampers (228) having mutually divided structures for individually clamping the plurality of workpieces (W) held by the workpiece holding part (205), and cavity pieces (226) capable of moving up and down without interlocking with the clampers (228) at the center position in each of the plurality of clampers (228) in plan view, the sealing mold (202) comprising clamper springs (232) that urge the clampers (228) toward the workpiece holding part (205), and cavity piece springs (230) that urge the cavity pieces (226) toward the workpiece holding part (205).
More Like This:
Inventors:
NOMURA YUDAI (JP)
Application Number:
PCT/JP2022/028336
Publication Date:
June 15, 2023
Filing Date:
July 21, 2022
Export Citation:
Assignee:
APIC YAMADA CORP (JP)
International Classes:
B29C43/36; H01L21/56
Foreign References:
| JP2005088395A | 2005-04-07 | |||
| JP2016101743A | 2016-06-02 | |||
| JP2005053143A | 2005-03-03 | |||
| JP2002151531A | 2002-05-24 |
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
Download PDF:
Previous Patent: HIGH FREQUENCY EMPHASIS AMOUNT CONTROL DEVICE
Next Patent: RESIN SEALING DEVICE AND SEALING MOLD
Next Patent: RESIN SEALING DEVICE AND SEALING MOLD